設備名稱 Equipment Name
槽式RCA清洗設備 Batch-type RCA Cleaning Equipment
設備型號 Equipment Model
SC-CSZJ9600E-20F
設備用途 Equipment Application
用于擴散后的硅片去繞鍍、清洗處理。
Used for wrap around removal & cleaning of the diffused silicon wafers.
工藝流程 Process Flow
去繞鍍→后清洗→酸洗→后清洗→酸洗→預脫水→烘干 (供參考)
Wrap Around Removal → Post-clean→ Acid Clean → Post-clean→Acid Clean→ Hot Water Drying → Drying (for reference)
技術特點 Features
1、產(chǎn)能:400片/批,9600片/小時(210硅片),480片/批,12000片/小時(182硅片)。
Throughput: 400pcs/batch, 9600pcs/h(210mm wafer),480pcs/batch, 12000pcs/h (182mm wafer).
2、支持多種添加劑技術。
Various additive technologies available.
3、支持最薄120μm硅片。
Wafer thickness down to 120μm.
4、潔凈區(qū)域干燥,自潔凈系統(tǒng)。
With dry clean area and self-cleaning system.
5、快速換液,在線換液。
Quick inline bath change.
6、支持MES、RFID及選配在線稱重功能。
Available with MES, RFID system, inline weight testing optional.
設備參數(shù) Parameters