板式透明导电薄膜沉积设备(RPD/PAR/PVD)

设备名称 Equipment Name

板式透明导电薄膜沉积设备(RPD/PAR/PVD)  Inline TCO Coating Equipment (Reactive Plasma Deposition, RPD/PAR),and Magnetron Sputter,PVD

设备型号 Equipment Model

PAR5500A

设备用途 Equipment Application

板式物理镀膜设备用于镀着透明导电薄膜于衬底(硅片、玻璃片、柔性基板)。

In-line physical coating equipment for Transparent Conductive Oxide (TCO) coating on wafer,glass plate or flexible substrate.

镀膜原理 Coating Principle

1、磁控溅射沉积。

Magnetron Sputter (PVD).

2、反应式等离子体沉积。

Reactive Plasma Deposition (RPD).

技术特点  Features

1、PVD具有多阶阴极，可以制备种子层与多种折射率的叠层TCO。

Multiple cathode operation for seed layer and multiple refractive index tandem TCO.

2、RPD具有无高能离子轰击衬底特点，能制备高少子迁移率的TCO。
No bombardment on the substrate while keeping high mobility.

设备参数  Parameters